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BrochureDuoQ
Multilayer Thin Film Deposition System
The DuoQ is an automated and versatile large chamber dual sputter coater offering unparalleled ease of use and flexibility based on your application needs. Recommended for controlled thin film deposition for electron microscopy sample preparation and material fabrication.
Product features
- Turbomolecular pumped system with ultimate vacuum of 1x10⁻⁶ mbar, enabling high quality coatings
- Dual head design offering sequential deposition of thin film coatings under high vacuum conditions
- Optimised stages for uniform deposition across 4” and 6” diameter samples
- Integrated Film Thickness Monitor (FTM) to control deposition of coating
- Intuitive and responsive touchscreen colour panel design
- Multi-colour LED visual status indicator offering process updates
- Pre-set recipes for standard protocols resulting in sample reproducibility
- Customisable recipes enabling users to tailor process parameters to their specific requirements
- Compatible with a range of target materials
Typical applications
The high vacuum DuoQ offers superior quality coatings to support with a wide range of applications, the instrument offers the following benefits:
- Fine-grained thin films recommended for high resolution electron microscopy imaging and analysis
- Controlled deposition for streamlining material fabrication processes
- Highly automated functions providing increased sample throughput and reproducibility
- Enhanced coating uniformity for a range of sample morphologies, up to 6” diameter in size
- Improved coating durability through deposition of adhesion layers
Electron Microscopy
- High resolution imaging for detailed surface and structural analysis
- Enhanced surface conductivity for improved imaging performance
- Uniform fine-grained coatings for superior sample preparation
- Reduced charging effects and improved analytical accuracy
Materials Research
- Precision thin film deposition for advanced applications
- Controlled materials fabrication with consistent results
- Capability to process large-area substrates efficiently
- Support for research, development, and prototype production
Advanced Materials
- Novel batteries and fuel cells
- Development and study of quantum materials
- Semiconductor materials for electronics and microdevices
- Photonic materials for optical and communication systems
Specifications
Instrument Specifications
- Unit Weight: 40 Kg
- Packed weight: 52 Kg (approximately)
- Instrument size: 440 mm (W) x 562 mm (H) x 551 mm (D)
- Instrument size with chamber open: 440 mm (W) x 912 mm (H) x 551 mm (D)
- Chamber size: 300 mm Ø diameter, 220 mm (H)
- Specimen stage: 80 mm (H) from chamber base (standard stage required for sputtering tall samples), 100 mm and 150mm Ø diameter substrate.
- 145mm (H) from chamber base (extended stage required for sputtering short samples), 100 mm and 150mm Ø diameter substrate.
Performance
- Ultimate vacuum: 1x10⁻⁶ mbar or lower
- Operational vacuum: 5x10⁻⁶ mbar
- Vacuum gauge range: 1000 mbar to 6.7x10⁻⁹ mbar
- User interface: Touch screen colour display
Power Supply
- Supply Voltage: 100-240 V, 50-60 Hz
- Power Consumption (Incl. rotary pump): 1400 VA
Deposition
- Deposition Current: 1-150 mA
- Deposition Rate: 0.1-20 nm/min (e.g. for gold)
- Sputter Timer: 0-480 min
- Sputter target: Target Disc style, 57 mm Ø diameter x 0.3 mm thickness (chromium and gold target supplied as standard)
Film Thickness Monitor (FTM)
- Quartz crystal: Gold, 12 mm Ø diameter, 5 MHz RC quartz crystals
- Thickness range: 1-2000 nm
- Tooling factor range: 0.1-10